| PART |
Description |
Maker |
| CL31A226MQCLNNC |
Multi Layer Ceramic Capacitor
|
Samsung
|
| CL21A106KPFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
| CL05A104KA5NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL21B105KBFNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| PS205KVP8.2PF/-2PFR16 PS405KVP1000PF/-10N2200 PS20 |
CAPACITOR, CERAMIC, 0.0000082 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.001 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00033 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00039 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000047 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00002 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000022 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000027 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000056 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.0000068 uF, CHASSIS MOUNT
CAPACITOR, CERAMIC, 0.00012 uF, CHASSIS MOUNT
|
Vishay Intertechnology, Inc.
|
| CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| DAU01R103M-TA DAF01W103K DAF01R103M DAF01W103M DAF |
CERAMIC MULTI-LAYER AXIAL DA
|
Dubilier
|
| CS1005X7R104B100NBA CS1005X7R104B100NBB CS1005X7R1 |
Multi Layer Ceramic Capacitors
|
SAMWHA ELECTRIC
|
| ILC0805ER3N3S ILC0805ER39NJ ILC0805ER2N2S ILC0805E |
Surface Mount, Multi Layer High Frequency Ceramic Inductor
|
http://
Vishay Siliconix
|
| HTR05 HTR07 HTR04 HTR01 HTR02 HTR03 |
(HTR01 - HTR07) High Voltage Commercial and Military Quality Multi-Layer Ceramic Capacitors
|
CalRamic
|
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